MI300X
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Specification | Details |
---|---|
Integrated CPU+GPU Package | Yes |
Target Market | Exascale Supercomputer Market |
Transistors | 153 Billion |
Zen 4 Cores | Up to 24 |
GPU Architecture | CDNA 3 |
Memory | Up to 128 GB HBM3 |
Chiplets + Memory Stacks | Up to 6 Chiplets + 8 Memory Stacks (5nm + 6nm process) |
Sampling | Now |
Ramp | Q4 2023 |
Infinity Cache and 4th Gen Infinity Architecture | Yes |
Unified Memory APU Architecture and New Math Formats | Yes |
Performance per Watt Uplift over CDNA 2 | 5x |
AI Performance versus CDNA 2-based Instinct MI250X | Over 8x |
CDNA 4 Compute Units | Up to 228 |
Socket Compatibility | SH5 |
Specification | Details |
---|---|
Integrated CPU+GPU Package | No |
Target Market | Exascale Supercomputer Market |
Transistors | 153 Billion |
Zen 4 Cores | 0 |
GPU Architecture | CDNA 3 |
Memory | Up to 192 GB HBM3 |
Chiplets + Memory Stacks | Up to 8 Chiplets + 8 Memory Stacks (5nm + 6nm process) |
Sampling | Q3 2023 |
Ramp | Q4 2023 |
Infinity Cache and 4th Gen Infinity Architecture | Yes |
Unified Memory APU Architecture and New Math Formats | No |
Performance per Watt Uplift over CDNA 2 | Not specified |
AI Performance versus CDNA 2-based Instinct MI250X | Not specified |
CDNA 4 Compute Units | Up to 304 |
Socket Compatibility | SH5 |