| Feature |
Specification
|
| Manufacturing Process |
7nm
|
| System Interface, Bandwidth, Interconnection Protocol |
PCIe 4.0/5.0 X16, Supports CXL
|
| TF32+ TFLOPS (Peak) |
256
|
| BF16 TFLOPS (Peak) |
512
|
| INT8 TOPS (Peak) |
1024
|
| Memory Capacity, Interface Width, Bandwidth |
32GB HBM2E; 2,048bit, 819GB/s
|
| Interconnection |
192GB/s BLink™, Supports 3 ports, up to 4 cards full interconnection
|
| Secure Virtual Instances |
Up to 4
|
| Video Encoding/Decoding (FHD@30fps) |
32-channel HEVC/H.264 encoding, 256-channel HEVC/H.264 decoding
|
| TDP |
300W
|
| Product Form |
Full-height, full-length, dual-slot PCIe card
|