壁砺™104系列：修订间差异

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（创建页面，内容为“{| class="wikitable" |+ Summary of Wallstone™ 104P |- ! Feature !! Specification |- | Manufacturing Process || 7nm |- | System Interface, Bandwidth, Interconnection Protocol || PCIe 4.0/5.0 X16, Supports CXL |- | TF32+ TFLOPS (Peak) || 256 |- | BF16 TFLOPS (Peak) || 512 |- | INT8 TOPS (Peak) || 1024 |- | Memory Capacity, Interface Width, Bandwidth || 32GB HBM2E; 2,048bit, 819GB/s |- | Interconnection || 192GB/s BLink™, Supports 3 ports, up to 4 cards full i…”）
 
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{| class="wikitable"
{| class="wikitable"
|+ Summary of Wallstone™ 104P
|+ Summary of 壁砺™ 104P
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! Feature !! Specification
! Feature !! Specification
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{| class="wikitable"
{| class="wikitable"
|+ Wallaby™ 104S Chip Specifications
|+ 壁砺™ 104S Chip Specifications
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! Specification !! Details
! Specification !! Details

2023年11月6日 (一) 23:20的最新版本

Summary of 壁砺™ 104P
Feature Specification
Manufacturing Process 7nm
System Interface, Bandwidth, Interconnection Protocol PCIe 4.0/5.0 X16, Supports CXL
TF32+ TFLOPS (Peak) 256
BF16 TFLOPS (Peak) 512
INT8 TOPS (Peak) 1024
Memory Capacity, Interface Width, Bandwidth 32GB HBM2E; 2,048bit, 819GB/s
Interconnection 192GB/s BLink™, Supports 3 ports, up to 4 cards full interconnection
Secure Virtual Instances Up to 4
Video Encoding/Decoding (FHD@30fps) 32-channel HEVC/H.264 encoding, 256-channel HEVC/H.264 decoding
TDP 300W
Product Form Full-height, full-length, dual-slot PCIe card
壁砺™ 104S Chip Specifications
Specification Details
Manufacturing Process 7nm
System Interface, Bandwidth, Interconnect Protocol PCIe 4.0 X16
TF32+ TFLOPS (Peak) 170.5
BF16 TFLOPS (Peak) 341
INT8 TOPS (Peak) 682
Memory Capacity, Interface Width, Bandwidth 32GB HBM2E; 2,048bit, 819GB/s
Video Encoding/Decoding (FHD@30fps) 32-channel HEVC/H.264 encoding, 256-channel HEVC/H.264 decoding
TDP 150W
Product Form Full-height, full-length, single-slot PCIe card
取自“http://perf.wiki/index.php?title=壁砺™104系列&oldid=1012”