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{| class="wikitable" |+ Summary of 壁砺™ 104P |- ! Feature !! Specification |- | Manufacturing Process || 7nm |- | System Interface, Bandwidth, Interconnection Protocol || PCIe 4.0/5.0 X16, Supports CXL |- | TF32+ TFLOPS (Peak) || 256 |- | BF16 TFLOPS (Peak) || 512 |- | INT8 TOPS (Peak) || 1024 |- | Memory Capacity, Interface Width, Bandwidth || 32GB HBM2E; 2,048bit, 819GB/s |- | Interconnection || 192GB/s BLink™, Supports 3 ports, up to 4 cards full interconnection |- | Secure Virtual Instances || Up to 4 |- | Video Encoding/Decoding (FHD@30fps) || 32-channel HEVC/H.264 encoding, 256-channel HEVC/H.264 decoding |- | TDP || 300W |- | Product Form || Full-height, full-length, dual-slot PCIe card |} {| class="wikitable" |+ 壁砺™ 104S Chip Specifications |- ! Specification !! Details |- | Manufacturing Process || 7nm |- | System Interface, Bandwidth, Interconnect Protocol || PCIe 4.0 X16 |- | TF32+ TFLOPS (Peak) || 170.5 |- | BF16 TFLOPS (Peak) || 341 |- | INT8 TOPS (Peak) || 682 |- | Memory Capacity, Interface Width, Bandwidth || 32GB HBM2E; 2,048bit, 819GB/s |- | Video Encoding/Decoding (FHD@30fps) || 32-channel HEVC/H.264 encoding, 256-channel HEVC/H.264 decoding |- | TDP || 150W |- | Product Form || Full-height, full-length, single-slot PCIe card |}
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