Ascend910系列:修订间差异
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Architecture of Ascend 910 Chips | === Architecture of Ascend 910 Chips === | ||
[[Image:Huawei-Ascend-910-AI-Training-Chip-Block-Diagram.jpg|700px]] | [[Image:Huawei-Ascend-910-AI-Training-Chip-Block-Diagram.jpg|700px]] |
2023年11月3日 (五) 14:13的版本
Architecture of Ascend 910 Chips
Main features:
- The Huawei Ascend 910 has 32 DaVinci AI cores.
- The chip combines these DaVinci AI cores with high-speed HBM2 memory.
- The main chip also has additional logic blocks such as 128 channel video decoding engines.
- There is a Nimbus V3 chip that handles most of the I/O and is co-packaged alongside the main chip and the HBM2 stacks.
- The Huawei Ascend 910 is designed to run at a higher power envelope (350W) and higher performance compared to the Ascend 310.
- Huawei claims 256 TFLOPs of FP16 performance for the Ascend 910.
- The Tesla V100 has 112-125 TFLOPs for deep learning thanks to its tensor cores.